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Prelamination, imagewise exposure of photohardenab

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专利名称:Prelamination, imagewise exposure of

photohardenable layer in process forsensitizing, registering and exposing circuitboards

申请号:US47949483申请日:19830328公开号:US4528261B1公开日:19881115

摘要:Actinic radiation exposes photohardenable material in two steps wherebyphotohardenable material not present as a solid is exposed through a photomask priorto application to a substrate and in a second step is reexposed through the photomaskafter application of the material to the substrate.

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